ST M32WBA5MMG Bluetooth LE and IEEE 802.15.4 Radio Module Owner's Manual

Ultra-low-power 2.4 GHz RF transceiver supporting Bluetooth® LE, IEEE 802.15.4 supporting Thread, Matter for Border router, and Zigbee®
Programmable output power up to +10 dBm with 1 dB steps
Rx sensitivity: -96 dBm (Bluetooth® LE at 1 Mbit/s), -97.5 dBm (IEEE 802.15.4 at 250 Kbit/s)
Up to 33 I/Os (most of them 5 V-tolerant) with interrupt capability

Bezpečnost a kryptografie

Secure firmware installation (SFI)
Advanced encryption standards (AES) accelerators
Public key accelerator (PKA)
Protection against differential power analysis (DPA)
HASH hardware accelerator
Skutečný generátor náhodných čísel (RNG)
96-bit UID
Výpočetní jednotka CRC

Flash readout and hide protection (RDP and HDP)
Tamper detekce
Root hardware unique key (RHUK)

Seriál wire debug (SWD) and JTAG
Vhodný for 2 layer PCB product design
Vše packages are ECOPACK2 compliant.

Aplikace

Domácí automatizace
Wellness, zdravotnictví, osobní trackery

Hry a hračky
Majáky a příslušenství
Průmyslový

Zavedení

This document provides the ordering information and mechanical device characteristics of the STM32WBA5MMG module. It must be read in conjunction with DS14127, RM0493, and ES0592, available on www.st.com.
The STM32WBA5MMG module is based on the STM32WBA55UG wireless microcontroller, which integrates an Arm® core.
For information on Arm® Cortex® cores, refer to the relevant Cortex® technical reference manual, available from the www.arm.com webmísto.

For information on Bluetooth® refer to www.bluetooth.com webmísto.

Poznámka:
Arm je registrovaná ochranná známka společnosti Arm Limited (nebo jejích dceřiných společností) v USA a/nebo jinde.

Referenční dokumenty

Reference manual Multiprotocol wireless Bluetooth® Low-Energy and IEEE802.15.4, STM32WBA5xxx Arm®‑based 32-bit MCUs (RM0493)
STM32WBA5xxx datasheet (DS14127)

STM32WBA5x device errata (ES0592)

Popis

The STM32WBA5MMG is an ultra-low-power, small form factor, certified 2.4 GHz wireless module. It supports Bluetooth® LE, Zigbee® 3.0, OpenThread, dynamic and static concurrent modes, and IEEE 802.15.4 proprietary protocols. Based on the STM32WBA55UG wireless microcontroller, it provides best-in-class RF performance thanks to its good receiver sensitivity and a high output power signal. Its low-power features enable extended battery life time, small coin-cell batteries.
The STM32WBA5MMG requires no RF expertise. It is the best way to speed up application development and to reduce the associated costs. The module is completely protocol stack royalty-free.

Konec moduluview
The module is an SiP-LGA76 package (system in package land grid array) that integrates the proven STM32WBA55UG MCU with several external components. The package includes:

krystal LSE
HSE krystal

passive components for SMPS
antenna matching and antenna
IPD pro RF přizpůsobení a potlačení harmonických

Napájení
The power supply requirements are identical to those of the STM32WBA55UG devices, detailed in the datasheet DS14127. Filtering capacitors on power supply pins and components for the SMPS are already integrated into the module.

Hodiny
As the crystals are already integrated into the package, it is impossible to use any clock in bypass mode. The module integrates a 32.768 kHz crystal for LSE and a 32 MHz crystal for the HSE clock.

To tune the HSE clock, the software must read trim data from OTP address 0x0BF9 000E and copy it to the RCC_ECSCR1.HSETRIM register.
The user must not change the RCC_ECSCR1 register configuration to keep the default parameters.
K dispozici jsou výstupy LSCO a MCO.

Anténa
The rectangular module has one shorter side clearly different from the remaining finish surface. This side is unshielded and the mold cover contains the integrated antenna.
To use the internal antenna, pin 51 (ANT_INT) and pin 50 (ANT_EXT) must be connected as in Figure 2.
If an external antenna is used, ANT_IN must be shorted to ground, and ANT_OUT connected to the external antenna matching network and to the antenna itself, as in Section 3.3: Antenna.

OTP
The STM32WBA5MMG features a 1-Kbyte one-time programmable (OTP) memory for use by the end product (see details in DS14127 and RM0493).

Poznámka
The device uses the first and last words of this area for trimming and identification purposes. As a consequence, addresses 0xBF90000h to 0xBF9000Fh and 0xBF090190h to 0xBF901FFh cannot be changed.

Dostupné periferie

All peripherals available in STM32WBA5 series microcontrollers based on the UFBGA59 package are available and accessible on this module.
The pins on the module offer access to the following system peripherals:

12-bit ADC 2.5 Msps with hardware oversampling

Three UARTs (ISO 7816, IrDA, modem)
Two SPIs
Two I2C Fm+ (1 Mbit/s), SMBus/PMBus®

Touch sensing controller, up to 20 sensors, supporting touch key, linear and rotary touch sensors
One 16-bit, advanced motor control timer
Tři 16bitové časovače

One 32-bit timer
Two low-power 16-bit timers (available in Stop mode)
Two Systick timers

Two watchdogs
8-channel DMA controller, functional in Stop mode

Popisy pinů

Figure 3. STM32WBA5MMG module pinout

Package bottom view

Tabulka 1. STM32WBA5MMG pin/ball definition

Název pinu			Typ špendlíku
STM32WBA5MMG	STM32WBA55UGI	Function after reset	Typ špendlíku
1	–	GND	S
2	–	GND	S
3	–	GND	S
4	–	GND	S
5	–	GND	S
6	–	GND	S
7	A3	PA10	I/O
8	B3	PA9	I/O
9	A2	PB14	I/O
10	B2	PB13	I/O
11	C2	PB12	I/O
12	D2	PB11	I/O
13	D1	PA8	I/O
14	E2	PA7	I/O
15	E1	PA6	I/O
16	G1	PA4	I/O
17	G2	PA3	I/O
18	H1	PA0	I/O
19	–	GND	S
20	F1	VDDA	S
21	–	GND	S
22	E4	VDD	S
23	–	GND	S
24	H2	PA1	I/O
25	G3	PA2	I/O
26	H3	PB9	I/O
27	F3	PA5	I/O
28	G5	PC13	I/O
29	H5	PB8	I/O
30	G6	PB6	I/O
31	H6	PB7	I/O
32	G7	PB3	I/O
33	H7	PB5	I/O
34	G8	PA15	I/O
35	H8	PB4	I/O
36	–	GND	S
37	F6	PA14	I/O
38	F8	PA13	I/O
39	F7	PA12	I/O

Název pinu			Typ špendlíku
STM32WBA5MMG	STM32WBA55UGI	Function after reset	Typ špendlíku
40	E8	PA11	I/O
41	E7	PB2	I/O
42	D8	PB1	I/O
43	D7	PB0	I/O
44	C8	PB15	I/O
45	–	GND	S
46	C7	LOĎ0	I/O
47	–	GND	S
48	B8	NRST	I/O
49	–	GND	S
50	–	ANT_OUT	O
51	–	ANT_IN	I
52	–	GND	S
53	–	GND	S
54	–	GND	S
55	–	GND	S
56	–	GND	S
57	–	GND	S
58	–	GND	S
59	–	GND	S
60	–	GND	S
61	–	GND	S
62	–	GND	S
63	–	GND	S
64	–	GND	S
65	–	GND	S
66	–	GND	S
67	–	GND	S
68	–	GND	S
69	–	GND	S
70	–	GND	S
71	–	GND	S
72	–	GND	S
73	–	GND	S
74	–	GND	S
75	–	GND	S
76	–	GND	S

Elektrické charakteristiky

Provozní podmínky

Table 2. STM32WBA5MMG operating conditions

Parametr	Min	Typ	Max	Jednotka
VDD	1.71	3.3	3.6	V
Rozsah provozní teploty okolí	-40	–	85	°C
Rozsah skladovacích teplot	-40	–	125	°C

Spotřeba energie
The power consumption is identical to the regular STM32WBA55. For details, refer to datasheet DS14127.

RF charakteristiky
For details, refer to datasheet DS14127.

Schematics and layout for PCB
Napřamples of schematics and layout using this device, refer to the description of B-WBA5M-WPAN on st.com. In particular, the board designer must respect the distances indicated in Figure 4. No metal layers must be used in the clearance area.

Vyzařovací diagramy a účinnost antény
Refer to technical note TN1565 “Antenna radiation patterns of module STM32WBA5MMG”.

Informace o balíčku

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK je ochranná známka ST.

Označení zařízení
Refer to technical note “Reference device marking schematics for STM32 microcontrollers and microprocessors” (TN1433 ) available on www.st.com, for the location of pin 1 / ball A1 as well as the location and orientation of the marking areas versus pin 1 / ball A1.
Parts marked as “ES”, “E” or accompanied by an engineering sample notification letter, are not yet qualified and therefore not approved for use in production. ST is not responsible for any consequences resulting from such use. In no event will ST be liable for the customer using any of these engineering sampve výrobě. Před jakýmkoli rozhodnutím o použití těchto technických prostředků je nutné kontaktovat oddělení kvality STampprovozovat kvalifikační činnost.
A WLCSP simplified marking example (if any) is provided in the corresponding package information subsection.

SiP-LGA76 package information (B0N2)
This SiP-LGA is a 76-lead, 8 x 12.5 mm, system in package land grid array package.

Figure 5. SiP-LGA76 – Outline

Tabulka 3. SiP-LGA76 – Mechanická data

Symbol	milimetry			palce(1)
	Min	Typ	Max	Min	Typ	Max
A	1.372 ± 0.046			0.0540 ± 0.0018
A1	0.030 ± 0.020			0.0012 ± 0.0008
D	12.400	12.500	12.600	0.4882	0.4921	0.4961
D1	11.575			0.4557
E	7.900	8.000	8.100	0.3110	0.3150	0.3189
eD	0.525			0.0207
eE	0.500			0.0197
E1	7.050			0.2776
M	1.100 REF(2)			0.0433 REF
N(3)	76
S	0.242 REF			0.0095 REF
Lead width	0.350 x 0.300 0.350 x 0.350 0.600 x 0.600			0.0138 x 0.0118 0.0138 x 0.0138 0.0236 x 0.0236
aaa	0.100			0.0039
bbb	0.100			0.0039
ddd	0.100			0.0039

Hodnoty v palcích jsou převedeny z mm a zaokrouhleny na 4 desetinná místa.

Nominal value.
Number of pins.

Tepelné charakteristiky
The device thermal characteristics are defined below, and the constant values are given in Table 4:

θJA is the junction-to-ambient thermal resistance (EIA/JESD51-2 and EIA/JESD51-6).
θJA represents the resistance to the heat flowing from the chip to ambient air. It is an indicator of package heat dissipation capability, a lower θJA means better overall thermal performance. It is calculated as follows:
θJA = (TJ – TA)/PH where:
- TJ = teplota přechodu
- TA = okolní teplota
- PH = power dissipation

φJT is the junction-to-top-center thermal characterization parameter (EIA/JESD51-2 and EIA/JESD51-6).
φJT is used for estimating the junction temperature by measuring TT in an actual environment. It is calculated as follows:
- φJT = (TJ – TT)/PH
  where TT = temperature at the top-center of the package

θJC is the junction-to-case thermal resistance.
- θJC represents the resistance to the heat flowing from the chip to package top case. θJC is important when an external heat sink is attached on package top. It is calculated as follows:
- θJC = (TJ – TC)/PH
  where TC = case temperature attached with a cold plate

θJB is the junction-to-board thermal resistance (EIA/JESD51-8).
θJB represents the resistance to the heat flowing from the chip to PCB. θJB is used in compact thermal models for system‑level thermal simulation. It is calculated as follows:
- θJB = (TJ – TB)/PH
- where TB = board temperature with ring cold plate fixture applied

Tabulka 4. Tepelné charakteristiky

Symbol	Max TJ (°C)	TT (°C)	φJT (°C/W)	θJA (°C/W)	θJB (°C/W)	θJC (°C/W)
Hodnota	96.95	96.88	0.15	26.32	12.39	7.95

Design desky
For information and recommendations related to board design, landing pads, stencils, and the solder reflow profile for LGA packages, refer to AN5886 Guidelines for design and board assembly of land grid array packages, available on www.st.com.

Informace pro objednání

Poznámka
For a list of available options (such as speed and package) or for further information on any aspect of this device, contact your nearest ST sales office.

Osvědčení
The STM32WBA5MMG module, with its internal antenna, has passed the following certifications:

Bluetooth® LE (RF_PHY)
CE (RED)
FCC

ISED
Japonsko (MIC)
DOSAH

RoHS

Further certifications are underway:

Tchaj-wan (NCC)

Čína (SRRC)
Korea (KC)
Brazílie (ANATEL)

All certification reports are available on the STM32WBA5MMG page on www.st.com

Bluetooth® LE (RF_PHY) certification
The module has obtained Bluetooth® LE RF_PHY certification. The details are published on the webmísto Bluetooth.com.

CE certifikace
The STM32WBA5MMG module has obtained CE certification.
Modul je opatřen označením CE.

certifikace FCC
The STM32WBA5MMG module complies with part 15 of the FCC rules.
The FCC ID is YCP-32WBA5MMG01.
The module label on the box used for shipment includes the corresponding FCC ID. The operation is subject to the following two conditions:

Toto zařízení nesmí způsobovat škodlivé rušení.
Toto zařízení musí akceptovat jakékoli přijaté rušení, včetně rušení, které může způsobit nežádoucí provoz.

Poznámka
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference does not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

Přeorientujte nebo přemístěte přijímací anténu.
Zvětšete vzdálenost mezi zařízením a přijímačem.
Připojte zařízení do zásuvky v jiném okruhu, než ke kterému je připojen přijímač.
Požádejte o pomoc prodejce nebo zkušeného rádiového/TV technika.

Oddělení
To meet the SAR exemption for portable conditions, the minimum separation distances indicated in Minimum Separation Distances for SAR Evaluation Exemption must be maintained between the human body and the radiator (antenna) at all times.
This transmitter module is tested in a standalone RF Exposure condition, and in case of any co-located radio transmitter being allowed to transmit simultaneously, or in case of portable use at closer distances from the human body than those allowing the exceptions rules to be applied, a separate additional SAR evaluation, or a reduction in the max output power or in the duty-cycle, might be required for the host, ultimately leading to a Class II Permissive Change, or more rarely to a new grant.
Important note: In the event that the conditions for the exemption cannot be met, the final product will likely have to undergo additional testing to evaluate the RF Exposure, or go through some re-configuration of the max output power and/or duty-cycle in order for the FCC authorization to remain valid, and a permissive change will have to be applied. The SAR evaluation (and/or reconfiguration) is in the responsibility of the end-product’s manufacturer, as well as the permissive change that can be carried out with the help of the customer’s own Telecommunication Certification Body, following a Change in ID authorization by the module’s original grant holder.

Požadavky na štítky
Není-li identifikační číslo viditelné, když je modul instalován uvnitř jiného zařízení, musí být na vnější straně zařízení, do kterého je modul instalován, také umístěn štítek odkazující na přiložený modul. Tento štítek musí obsahovat FCC ID, které se shoduje s tím na modulu.

Požadavky na dokumentaci
Uživatelská příručka nebo návod k použití záměrného nebo neúmyslného chladiče musí uživatele varovat, že změny nebo úpravy, které nejsou výslovně schváleny stranou odpovědnou za shodu, by mohly zrušit oprávnění uživatele provozovat zařízení.

Požadavky na integraci
Colocation of this module with other transmitters that operate simultaneously are required to be evaluated using the multi-transmitter procedures.
Hostitelský integrátor se musí řídit integračními pokyny uvedenými v tomto dokumentu a zajistit, že koncový produkt kompozitního systému vyhovuje požadavkům technickým posouzením nebo hodnocením podle pravidel a publikací KDB 996369.
Hostitelský integrátor, který instaluje tento modul do svého produktu, musí zajistit, že konečný kompozitní produkt vyhovuje požadavkům technickým posouzením nebo hodnocením podle pravidel, včetně provozu vysílače, a měl by se řídit pokyny v KDB 996369.

Certifikace ISED
The STM32WBA5MMG module has been tested and found compliant with the ISED RSS-247 and RSS-Gen rules.
The ISED ID is 8976A-32WBA5MMG01.

This module contains license-exempt transmitter(s) that comply with Innovation, Science and Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions:

This module may not cause interference.
Tento modul musí akceptovat jakékoli rušení, včetně rušení, které může způsobit nežádoucí činnost modulu.

MIC certification
The STM32WBA5MMG module is certified in Japan with certification number 217‑252089.

Likvidace produktu
Disposal of this product: WEEE (Waste Electrical and Electronic Equipment) (Applicable in Europe)

This symbol on the product, accessories, or accompanying documents indicates that the product and its electronic accessories should not be disposed of with household waste at the end of their working life.
To prevent possible harm to the environment and human health from uncontrolled waste disposal, please separate these items from other type of waste and recycle them responsibly to the designated collection point to promote the sustainable reuse of material resources.

Household users
You should contact either the retailer where you buy the product or your local authority for further details of your nearest designated collection point.

Firemní uživatelé
You should contact your dealer or supplier for further information.

Důležité bezpečnostní upozornění

The STMicroelectronics group of companies (ST) places a high value on product security, which is why the ST product(s) identified in this documentation may be certified by various security certification bodies and/or may implement our own security measures as set forth herein. However, no level of security certification and/or built-in security measures can guarantee that ST products are resistant to all forms of attacks. As such, it is the responsibility of each of ST’s customers to determine if the level of security provided in an ST product meets the customer needs both in relation to the ST product alone, as well as when combined with other components and/or software for the customer end product or application. In particular, take note that:

Produkty ST mohly být certifikovány jedním nebo více bezpečnostními certifikačními orgány, jako je Platform Security Architecture (www.psacertified.org) and/or Security Evaluation standard for IoT Platforms
(www.trustcb.com). Podrobnosti o tom, zda produkty ST uvedené v tomto dokumentu obdržely bezpečnostní certifikaci spolu s úrovní a aktuálním stavem takové certifikace, naleznete v příslušných certifikačních standardech webnebo přejděte na příslušnou stránku produktu www.st.com for the most up to date information. As the status and/or level of security certification for an ST product can change from time to time, customers should re-check security certification status/level as needed. If an ST product is not shown to be certified under a particular security standard, customers should not assume it is certified.
Certification bodies have the right to evaluate, grant and revoke security certification in relation to ST products. These certification bodies are therefore independently responsible for granting or revoking security certification for an ST product, and ST does not take any responsibility for mistakes, evaluations, assessments, testing, or other activity carried out by the certification body with respect to any ST product.
Industry-based cryptographic algorithms (such as AES, DES, or MD5) and other open standard technologies which may be used in conjunction with an ST product are based on standards which were not developed by ST. ST does not take responsibility for any flaws in such cryptographic algorithms or open technologies or for any methods which have been or may be developed to bypass, decrypt or crack such algorithms or technologies.
While robust security testing may be done, no level of certification can absolutely guarantee protections against all attacks, including, for example, against advanced attacks which have not been tested for, against new or unidentified forms of attack, or against any form of attack when using an ST product outside of its specification or intended use, or in conjunction with other components or software which are used by customer to create their end product or application. ST is not responsible for resistance against such attacks. As such, regardless of the incorporated security features and/or any information or support that may be provided by ST, each customer is solely responsible for determining if the level of attacks tested for meets their needs, both in relation to the ST product alone and when incorporated into a customer end product or application.
Všechny funkce zabezpečení produktů ST (včetně jakéhokoli hardwaru, softwaru, dokumentace a podobně), včetně, ale bez omezení na jakékoli vylepšené funkce zabezpečení přidané společností ST, jsou poskytovány „TAK, JAK JSOU“. V TAKOVÉM ROZSAHU POVOLENÉM PŘÍSLUŠNÝM ZÁKONEM, STŘED ODMÍTÁ VŠECHNY ZÁRUKY, VÝSLOVNÉ NEBO PŘEDPOKLÁDANÉ, VČETNĚ, ALE NE OMEZENÉ, PŘEDPOKLÁDANÝCH ZÁRUK OBCHODOVATELNOSTI NEBO VHODNOSTI PRO KONKRÉTNÍ ÚČEL, pokud příslušné písemné a podepsané smluvní podmínky výslovně nestanoví jinak.

Historie revizí

Tabulka 5. Historie revizí dokumentu

Datum	Revize	Změny
19. prosince - 2024	1	Počáteční vydání.
13-března-2025	2	Přidáno: Bluetooth® LE in Section Features Section 9: Certification and related subsections. Section 10: Product disposal Updated occurrences of Bluetooth Low Energy to Bluetooth® LE.
06. května 2025	3	Updated Section 9.3: FCC certification.

DŮLEŽITÉ UPOZORNĚNÍ – ČTĚTE POZORNĚ
STMicroelectronics NV a její dceřiné společnosti (“ST”) si vyhrazují právo provádět změny, opravy, vylepšení, úpravy a vylepšení produktů ST a/nebo tohoto dokumentu kdykoli bez upozornění. Kupující by měli před zadáním objednávky získat nejnovější relevantní informace o produktech ST. Produkty ST jsou prodávány v souladu s prodejními podmínkami ST platnými v době potvrzení objednávky.
Kupující jsou výhradně odpovědní za výběr, výběr a použití produktů ST a ST nepřebírá žádnou odpovědnost za pomoc s aplikací nebo design produktů kupujících.

Společnost ST zde neuděluje žádnou výslovnou ani předpokládanou licenci k právu duševního vlastnictví.
Další prodej produktů ST s ustanoveními odlišnými od informací uvedených v tomto dokumentu ruší jakoukoli záruku poskytnutou společností ST na takový produkt.
ST a logo ST jsou ochranné známky společnosti ST. Další informace o ochranných známkách ST viz www.st.com/trademarks. Všechny ostatní názvy produktů nebo služeb jsou majetkem jejich příslušných vlastníků.
Informace v tomto dokumentu nahrazují a nahrazují informace dříve uvedené v předchozích verzích tohoto dokumentu.
© 2025 STMicroelectronics – Všechna práva vyhrazena

FAQ

Q: Can I use an external antenna with the STM32WBA5MMG?
A: Yes, you can use an external antenna with the module. Ensure proper connections as described in the user manual section on antenna usage.
Q: What clock crystals are integrated into the module?
A: The module integrates a 32.768 kHz crystal for LSE and a 32 MHz crystal for the HSE clock.

Dokumenty / zdroje

ST STM32WBA5MMG Bluetooth LE and IEEE 802.15.4 Radio Module [pdfUživatelská příručka
YCP-32WBA5MMG01, YCP32WBA5MMG01, 32wba5mmg01, STM32WBA5MMG Bluetooth LE and IEEE 802.15.4 Radio Module, STM32WBA5MMG, Bluetooth LE and IEEE 802.15.4 Radio Module, LE and IEEE 802.15.4 Radio Module, 802.15.4 Radio Module, Radio Module, Module

Reference

Uživatelská příručka

ST M32WBA5MMG Bluetooth LE and IEEE 802.15.4 Radio Module